Calculate exact chemical quantities for bath make-up or replenishment. Covers sulphuric acid anodizing, caustic soda etch, nickel acetate sealing, nitric acid desmut, and alkaline degreaser baths.
| Bath | Chemical | Target (g/L or % v/v) | Operating temp | Notes |
|---|---|---|---|---|
| Sulphuric acid anodizing (Type II) | H₂SO₄ 98% | 180 – 200 g/L | 18 – 22 °C | Monitor by titration weekly; aluminium build-up > 20 g/L slows growth |
| Hard anodizing (Type III) | H₂SO₄ 98% | 150 – 180 g/L | −2 to +2 °C | Lower acid than Type II; chiller critical; add glycolic acid additive optional |
| Caustic soda etch (decorative) | NaOH flakes/beads 99% | 40 – 60 g/L | 55 – 65 °C | Add gluconate 1–2 g/L to control etch rate; Al build-up 10–15 g/L = change bath |
| Caustic soda etch (aggressive) | NaOH flakes/beads 99% | 80 – 120 g/L | 60 – 70 °C | For heavily machined surfaces; watch weight loss on 6063 |
| Nickel acetate sealing | Ni(CH₃COO)₂ sealing salts | 5 – 8 g/L | 95 – 98 °C | pH 5.5 – 6.5; use DI water only; 1 min per µm of coating |
| Nitric acid desmut | HNO₃ 65% | 20 – 30 % v/v | Ambient (20 – 25 °C) | For 6061/6063; add HF 1–2% v/v for 2xxx alloys (copper smut) |
| Alkaline degreaser | Proprietary powder (pH 11–12) | 30 – 50 g/L | 50 – 60 °C | Spray or immersion; rinse conductivity < 50 µS/cm before etch |
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